Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator.
The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating packaging and thermal effects co-simulation to analyze a complete packaged system. Discover how this comprehensive approach yields innovative solutions, important design insights, and their potential impact on packaged performance.
Register now for this free webinar!
What You Will Learn
Design and layout of a typical GaN amplifier using circuit and 3D EM toolsIncorporation of 3D component models (connectors, packages, etc.) for complete system analysisCo-simulation of packaged devices with thermal solvers
Who Should Attend
Electromagnetic and circuit design engineers: Delve into the co-simulation nuances between circuit models and full 3D designsSystem engineers: Develop an understanding of the packaged PA design and tradeoffsProfessionals in wireless communication: Gain comprehensive insights into the modern circuit/package co-simulation workflows
IEEE Spectrum
